Hey G’day, I have spent several days on this, I sent in a ticket several days ago to support still no reply.
I have got my galvo working ok with rotary with the following process, 1. fill shapes individually. 2. set split size to 2x or 3x your line width. This gives you the quickest rotary operation with Galvo and do do a full jacket around a bottle is 10 to 15 minutes depending on the design.
If you have any large areas to do it becomes a nightmare especially if you don’t use fill shapes individually.
My personal belief how they have set rotary to work with Galvo is flawed.
First you can’t get continuous rotary motion, you can with a diode laser running a cheap board, co2 so I don’t know if its a limitation with the ezcad board or what. No direct answers from digging in the forums.
The way you have to set up the stepper is so wrong 12800 rotations for 360 turn? Again is this a limitation of ezcad boards or what?
If your work is centred and and rotary centred as far as the machinery is concerned its a flat working area so why the limitation and split sizes? If anyone can explain why this coded for galvo rotary I could stop moaning about it and get on with the limitations at hand.
Its a little like the cleaning pass when doing 2.5d, why is it not a full clean, we don’t need whats being cut next to be clean we need the whole coin cleaned to stop the post processing or at least minimise it when the job is done.